吸锡器吸锡泵解焊拆卸真空

产品特点：
）重量轻，结构紧凑
）特性的塑料和合金结构
）帮助您快速，安全地完成任务
）经设计以从电路板和多去除焊料
） 使用方便; 简单地压低柱塞; 将喷嘴的前端对要删除的焊锡
）当焊料熔化; 按下释放按钮，回缩柱塞创建在尖端强大的真空; 除去熔化的焊料
）尺寸： （长x宽） 18.2 x 1.8厘米

套餐包括：
1个吸锡泵

SOLDER SUCKER DESOLDERING PUMP DESOLDER REMOVAL VACUUM

Features:
) Lightweight and compact
) Features plastic and alloy construction
) Helps you complete the task quickly and safely
) Designed to remove the solder from the circuit boards and more
) Easy to use; simply depress the plunger; place the tip of the nozzle against the solder you wish to remove
) When the solder melts; push the release button and a retracting plunger creates a strong vacuum at the tip; removing the melted solder
) Size: (L x W) 18.2 x 1.8cm

Package included:
1 x desoldering pump