标题
真空吸锡泵的拆除吸锡器

特征
设计为从电路板和多去除焊料
特点塑料合金结构
使用方便; 简单地压低柱塞; 将喷嘴的前端对要删除的焊锡
当焊料熔化; 按下释放按钮，回缩柱塞创建在尖端强大的真空; 除去熔化的焊料

Title
Vacuum Desoldering Pump Removal Solder Sucker

Feature
Designed to remove the solder from the circuit boards and more
Features plastic and alloy construction
Easy to use; simply depress the plunger; place the tip of the nozzle against the solder you wish to remove
When the solder melts; push the release button and a retracting plunger creates a strong vacuum at the tip; removing the melted solder