最佳0.8毫米BGA无铅焊锡丝焊丝焊锡条
最佳0.8毫米BGA无铅焊锡丝焊丝
技术指标
BGA焊锡线
1.体重: 0.6千克
2.大小: 0.8毫米
3.类型:无铅
4.合金: 99.3Sn / 0.7Cu钎
5.100 %的新和oringin
BGA锡线有铅焊锡线,无铅焊锡丝。
1)它可以在广播,通信,仪表,仪表和铜,锡和熨斗等加
2)残基是容易通过热空气焊接工作后,如有必要,除去
3 )可在许多合金成分,其他合金成分也可
4 )表面光滑,良好的流动性融
5 )良好的机械性能
6 )良好的防潮,明亮的焊点
7 )很少废料
8 )形式:棒材,线材



The Best 0.8mm BGA Lead-free Solder Wire Welding Wire
Specifications
BGA solder wire
1. weight: 0.6kg
2. size : 0.8mm
3. type: lead-free
4. alloy: 99.3Sn/ 0.7Cu
5.100%new and oringin
BGA solder wire include Leaded solder wire and Lead-free solder wire.
1) It can applied in radio, communication, meters, instruments and copper, tin and irons and etc.
2) Residue is easy to remove by hot air after soldering work if necessary
3) Available in many alloy composition, other alloy compositions are also available
4) Smooth surface, good fluidness melt
5) Good mechanical performance
6) Good moisture, bright weld spot
7) Very few scraps
8) Forms: Bar, wire


