is_customized：

是

品牌：

lainixiye

应用：

电子，电脑，电视，汽车，航空航天

型号：

sn993

无铅焊锡条采用优质郧西原材料和日本的电子焊接材料的研究和开发最先进的生产技术，材料，严格按照ROHS指令和SS的过程 - 00259的标准要求，从 原料熔炼，搅拌，检验，灌注结合高科技工艺生产的。 结合现代电子行业需求的绿色环保和产品可靠性的发展方向，采用纯天然云南锡锭无铅焊锡条生产。 根据严格的QC控制，有效地控制氧化和金属，非金属杂质，锡表面光滑，纯度高，流动性好程度，融化的润湿性优良，亮点，后发生氧化渣颗粒很少。 适用于各种波焊和手工焊接质量要求高，公司不断研发，？

文章认为，无铅锡氧化
？ 无铅高温焊锡条
？ 无铅的锡棒在低温下
？ 无铅消光
？ 无铅含银锡条
锡条，其他特​​殊用途
1，锡 - 0.7 - 铜无铅焊料
锡 - 0.7 - 铜焊酒吧
锡 - 0.7 - Cu系无铅焊料为Sn（锡），Cu共晶合金（铜），共晶温度是227，比传统的Sn / Pb焊料34更高。 在一般情况下，锡 - 0.7 - 的工作温度为270左右的Cu的Sn。
锡 - 0.7 - 铜无铅焊锡条，主要有以下特性：
A，高强度，良好的机械性能和焊点的可靠性
乙，灵敏度低的杂质，性能稳定
C，易回收，更符合欧盟的WEEE指令要求
研发，适用于各种焊接工艺，可广泛应用于各种铜的焊接，通源装置

2，锡 - 3.5 - 银无铅焊锡
锡 - 3.5 - 银焊锡条
锡 - 3.0 - 银无铅焊料的熔点是221，工作温度265。 锡 - 3.5 - Ag焊料高熔点焊料开始进入实用阶段，特别是它的固有细的组织和优良的机械性能和使用可靠性，成为明显的替代焊料合金由广大用户的所接受。
锡 - 3.0 - Ag焊料制品具有优异的机械性能，同时，由于锡银一般的Sn不坚固的融合 - 3.0 - Ag为稳定性良好的化合物，锡的Ag固态融合不存在，一旦形成的Ag3Sn， 当放入粗化温度高，不容易也是一个良好的焊接耐热性。

单位类型：

公斤

包装重量：

25.000千克（55.12磅。）

包装尺寸：

40厘米x19厘米×15厘米（15.75in x 7.48in x 5.91in）

is_customized:

Yes

Brand Name:

lainixiye

Application:

Electronic, computer, television, automobile, aerospace

Model Number:

sn993

Lead-free solder bar is made of high quality YunXi raw material and Japan the most advanced production technology of the electronic welding materials research and development, in the process of material in strict accordance with the ROHS directive and SS - 00259 standard requirements, from the raw material of smelting, stirring, inspection, perfusion combined with high technology process production. Combined with the modern electronics industry demand the development direction of green environmental protection and reliability of the product, using pure natural yunnan tin ingot to lead-free solder bar production. Under the strict qc control, effectively control the degree of oxidation and metal, non-metallic impurities, tin surface smooth, high purity, good liquidity, after melting excellent wettability, bright spot, oxide slag particles occur very rarely. Suitable for high quality requirements of various wave welding and manual welding, the company continuously research and development, ?

Article, unleaded tin oxidation
? lead free high temperature solder bar
? lead-free tin bar at low temperature
? the lead-free extinction
? lead free silver solder bar
Article tin, other special purposes
1, Sn - 0.7 - Cu lead-free solder
Sn - 0.7 - Cu Soldering Bar
Sn - 0.7 - Cu lead-free solder is Sn (tin) , Cu (copper) of eutectic alloys, eutectic temperature is 227 , 34 higher than the traditional Sn/ Pb solder. In general, Sn - 0.7 - Cu Sn of the working temperature at 270 or so.
Sn - 0.7 - Cu lead-free solder article mainly has the following properties:
A, high strength, good mechanical properties and solder joints reliability
B, low sensitivity to the impurities, stable performance
C, easy recovery, more in line with the eu WEEE directive requirements
D, suitable for all kinds of welding process, can be widely used in the welding of all kinds of brass, TongYuan device

2, Sn - 3.5 - Ag lead-free solder
Sn - 3.5 - Ag Soldering Bar
Sn - 3.0 - Ag lead-free solder melting point is 221 , working temperature 265 . Sn - 3.5 - Ag solder as high melting point solder has begun to enter the practical stage, especially its inherent fine organization and excellent mechanical properties and the use of reliability, become obvious alternative alloy solder accepted by the masses of users.
Sn - 3.0 - Ag solder article has excellent mechanical properties, at the same time, due to Sn Ag generally not solid fusion of Sn - 3.0 - Ag as stability good compounds, Ag solid fusion of Sn doesn't exist, once Ag3Sn formation, high temperature when placed coarsening, not easily also is a good solder heat resistance.

Unit Type:

kilogram

Package Weight:

25.000kg (55.12lb.)

Package Size:

40cm x 19cm x 15cm (15.75in x 7.48in x 5.91in)