晶元光电的高显色指数12瓦特COB LED筒灯
| 包装细节: | 白盒,彩盒或您的特殊要求。 |
|---|---|
| 交货详细信息: | 3-5天为样本,7-15days的量大 |
晶元光电的高显色指数12瓦特COB LED筒灯:
技术参数:
| 型号。: | KJ-DL12W-A01 | |||
| 输入: | AC85-265 / 50-60赫兹 | |||
| 能量消耗: | 12W | |||
| 色温: | 2800-7500K可选 | |||
| 光通量: | 950-1050LM | |||
| 材料: | 铝合金压铸+ PC | |||
| 工作温度; | -20 ~ +45 | |||
| LED数量: | 1个COB | |||
| 光源: | 晶元光电 | |||
| 寿命: | ≥50000Hrs | |||
| 安装孔尺寸: | 125MM | |||
| 尺寸: | φ145*63毫米 | |||
申请地方:
•广泛适用于别墅,宾馆,BOITE。 会议室,客厅,等室内照明
•采光天棚,下cabinent照明,墙上盖,背光照明
• 购物中心。 展柜,archtectural照明,商店,特种地面照明,显示器的原因,其他的射灯
•装饰照明,在其他地方需要高显色指数照明。
•12W LED天花灯=96瓦特白炽灯
什么是COB?
芯片上的电路板,或COB,是指半导体组装技术,其中微芯片或芯片直接安装,而不是接受传统的组装或包装作为一个单独的芯片上,并电连接到其最终的电路板,。 常规器件封装的消除从COB组件简化设计和制造的最终产品,以及改善其作为短的互连路径的结果表现的整个方法。
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| Packaging Details: | white box, color box or as your special requirement. |
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| Delivery Detail: | 3-5 days for samples, 7-15days for large quantity |
Epistar high CRI 12w cob led downlight :
Technical parameter:
| Model No.: | KJ-DL12W-A01 | |||
| Input: | AC85-265/50-60Hz | |||
| Power Consumption: | 12W | |||
| Color Temperature: | 2800-7500K Optional | |||
| Luminous Flux: | 950-1050LM | |||
| Materials: | Aluminum die casting+pc | |||
| Working Temperature; | -20 ~ +45 | |||
| LED Qty.: | 1 piece COB | |||
| Light Source: | Epistar | |||
| Life span: | ≥50000Hrs | |||
| installation hole dimension: | 125MM | |||
| Dimension: | φ145*63mm | |||
Application place:
• widely used in villa , hotel, boite. meeting room , living room, other indoor lighting
• ceiling lighting , under cabinent lighting, wall cover, back lighting
• shopping mall. showcase, archtectural lighting , shops-special ground lighting , display cause, other spot lighting
• Decoration lighting , other places which need high rendering index lighting.
• 12w led down light =96w incandescent lamp
What is COB?
Chip-on-Board, or COB, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically interconnected to its final circuit board, instead of undergoing traditional assembly or packaging as an individual IC. The elimination of conventional device packaging from COB assemblies simplifies the over-all process of designing and manufacturing the final product, as well as improves its performance as a result of the shorter interconnection paths.
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