特征：
●设计满足或超过IEEE 802.3,10Base-T规范
●提供用于EMI抑制的共模扼流圈
●UL 60950-1认证
●表面贴装，IC级，转移成型封装，可承受235°C的峰值温度曲线

FEATURES:
●Designed to meet or exceed IEEE 802.3,10Base-T specifications
●Available with common mode chokes for EMI suppression
●Recognized By UL 60950-1
●Surface mount , IC grade, transfer-molded package withstands 235°C peak temperature profile