HB-W750

Machine panorama

The world's first infrared heating core internal plus

Thermal conductivity Cotton and Built-in hole thermometer

High-quality imported heating core

Professional custom-made overall bottom preheat

Intermediate auxiliary support

Linear locking bearings

On the heating fixation device

Instructions for use

1: ①, check before starting the infrared radiator, temperature sensor and power cord is connected intact.

②, open the main power switch, the bottom of the preheat stage power switch, adjust the intelligent temperature control instrument in the 170-200range,

So that the bottom preheat 2-3bell.

③, the upper radiator heating head switch, used to control the infrared radiator work; press the temperature control panel SET button,

And other values ​​flashing, regulation '▲' up key, '▼' down key And a lateral numeric shift key, Available in 0-13Lt; 0 & gt; C

range Inside, Set the required welding temperature. Generally lead the upper welding temperature: 190-200 degrees,

Lead welding temperature: 240-260 between.

(2. Desoldering / repair process:

(1) the demolition of the operating process is generally:

① fixed PCB board;

② Adjust the infrared radiator temperature sensor, place it in the chip or chip near the appropriate location in the core

Flux (solder or solder) is applied around the chip and the sensor head, which allows the sensor to measure the temperature more accurately

While helping the role of flux flux.

③, adjust the location of the upper infrared radiator body, so that the vertical alignment of the infrared radiator to be demolished / rework the chip.

Adjust the infrared radiator temperature sensor and place it in place near the chip or chip.

And the sensor head coated with flux (solder Po or solder oil), this will enable the sensor to measure the temperature is more accurate, and help

Flux to help welding, BGA pad will be more intact, can effectively prevent the pad is glued up and play a role in such issues as tin.

Department radiator heating head height, keep the upper part of the heating head and desoldering height of 20-30mm is appropriate, then open the upper infrared

Radiator, lead-free welding for the preset temperature controller 170-190 or so in the welding process, special attention to temperature control, anti-

Only the sensor shift leaving the temperature is not allowed to lead to chip heating time is too long, the temperature is too high, burn the chip, the heating chip to

Preset temperature or chip tin plate melt, remove the chip with a vacuum pen or tweezers, turn off the infrared radiator switch.

⑤, etc. After the welding is completed, turn off the power.

(2), demolition / rework of various row of plugs and needle socket (such as CPU socket and GAP insertion);

General operation: the first part of the PCB to be exposed to the heat and do not desolate the device with aluminum foil cover, and then to the desoldering

The PCB board is fixed, open the preheat chassis power supply , Adjust Preheat temperature is 170-200 ° C, so that the bottom of the preheat2-3

Minute.Adjust the location of the upper infrared radiator body, so that the vertical alignment of the infrared radiator to be demolished / rework the chip, the temperature

Degree sensor Of the tip Placed next to the desoldering device Or upper surface Adjust the upper radiator heating head height, keep the upper heating

Head and desoldering height of 20-25Mm is appropriate, then open the upper infrared radiator, temperature controller can be preset temperature 180-190 or so

(Lead) , Desoldering device evenly heated, the general can be demolished.

For Pb-free devices, the temperature can be increased by 30 ° C-50℃ can be.

For dual-panel, you can use a lower preheat temperature pre-heating PCB board, supplemented by the top infrared heating can be.

(3), re-welding process is generally:

The basic process with the demolition process, the difference is: first clean up the pad and the solder ball, the correct placement of the chip, according to the ball back

Welding process temperature for preheating, reflow soldering, cooling. For lead-free devices can be further increased temperature 20-30 ℃ can be.

4, demolition welding / rework process of the Notes and related instructions:

①, for the simple package of the chip, it is recommended in the center of the chip (silicon position) pre-paste aluminum foil, to prevent the silicon

Thermal burst. Aluminum foil size is slightly larger than the silicon as well, nor too much, otherwise it will affect the chip welding effect.

②, desoldering / rework process, to ensure that the upper infrared radiator irradiation area, all the plastic plug, the application of aluminum foil

Cover, to prevent high-temperature infrared baking deformation or damage, but not all packages.

③, re-welding / rework the end of the PCB board, such as cooling, and then washed and dried and tested; if not, you can re-welding again.

④, before and after work, in the absence of PCB board placement case, Can not be a long time to open the upper infrared radiator, otherwise it will seriously affect

The life of the radiator.

VII, matters needing attention

1, after work, can Immediately turn off the power, Allowing it to cool naturally.

2, to maintain ventilation ventilation, infrared radiator clean.

3, careful, high temperature operation, pay attention to safety, to prevent burns.

4, do not use for a long time, should unplug the power plug!