Quick Details

• Light Source: LED
• Item Type: Ceiling Lights
• LED Light Source: Epistar cob
• Install Style: Embeded
• Input Voltage (V) : AC85-265V
• Lamp Power (W) : 12
• Lamp Luminous Flux (lm) : 950-1050
• Lamp Luminous Efficiency (lm/ w) : 110
• CRI (Ra) ) : 80
• Color Temperature (CCT) : Pure White
• Working Temperature (℃) : -20 - 45
• Working Lifetime (Hour) : 50000
• Lamp Body Material: Aluminum
• IP Rating: IP44
• Certification: CE, FCC, RoHS
• Place of Origin: Guangdong, China (Mainland)
• Brand Name: Kingjo
• Model Number: KJ-DL12W-A01
• high CRI: above 80
• lumens: 950-1050lm
• installation: easy install
• material: Aluminum die casting+pc
• application: indoor lighting

Packaging & Delivery

Packaging Details:	white box, color box or as your special requirement.
Delivery Detail:	3-5 days for samples, 7-15days for large quantity

Specifications

Epistar high CRI 12w cob led downlight:
1. CE, ROHS, FCC certificates;
2.950-1050lm
3. CIR) 80
4. Aluminum die casting+pc

Epistar high CRI 12w cob led downlight :

Technical parameter:

Model No.:		KJ-DL12W-A01
Input:		AC85-265/50-60Hz
Power Consumption:		12W
Color Temperature:		2800-7500K Optional
Luminous Flux:		950-1050LM
Materials:		Aluminum die casting+pc
Working Temperature;		-20 ~ +45
LED Qty.:		1 piece COB
Light Source:		Epistar
Life span:		≥50000Hrs
installation hole dimension:		125MM
Dimension:		φ145*63mm

Application place:

• widely used in villa , hotel, boite. meeting room , living room, other indoor lighting

• ceiling lighting , under cabinent lighting, wall cover, back lighting

• shopping mall. showcase, archtectural lighting , shops-special ground lighting , display cause, other spot lighting

• Decoration lighting , other places which need high rendering index lighting.

• 12w led down light =96w incandescent lamp

What is COB?

Chip-on-Board, or COB, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically interconnected to its final circuit board, instead of undergoing traditional assembly or packaging as an individual IC. The elimination of conventional device packaging from COB assemblies simplifies the over-all process of designing and manufacturing the final product, as well as improves its performance as a result of the shorter interconnection paths.

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